At the SPIE Photomask and EUV Lithography conference, Intel Foundry and ASML reported progress on High NA EUV volume readiness; the technology has already been used in production of some Core Ultra Series 3 (Panther Lake) processors on Intel's 18A process.
AMD claims that 14 EPYC 9965 servers can replace 100 dual-socket Intel Xeon Platinum 8280 servers aged 5-7 years, cutting server count by 86% while delivering the same total performance, reducing power consumption by 69% and three-year TCO by 41%.
Lam Research has broken ground on a new laboratory expansion at its R&D center in Tualatin, Oregon. Once complete, the facility will add 120,000 square feet, expanding cleanroom space by more than 50%, with operation expected in 2028.
AMD, Cisco and HUMAIN announced that AI infrastructure built on AMD Instinct MI355X GPUs, EPYC CPUs and Cisco Silicon One AI networking has officially gone live in Saudi Arabia, providing production-grade compute to HUMAIN customers, with plans to expand to 250 MW.
AMD announced that its Instinct GPUs and EPYC CPUs will provide the compute for Europe's next-generation LUMI-AI supercomputer. (The original article contains only AMD trademark download terms and provides no further technical details of the partnership.)
AMD, Cisco and HUMAIN announced that AI infrastructure based on AMD Instinct MI355X GPUs, AMD EPYC CPUs and Cisco Silicon One networking has gone live in Saudi Arabia, offering HUMAIN customers GPU-as-a-service from model training to inference, with plans to reach 1 GW by 2030.
In its AI Infrastructure Insight series, SK hynix explains that AI performance cannot rely solely on the compute of accelerators like GPUs; it also requires memory bandwidth, networking, storage and cooling to work in concert.
On August 25, at Dell Technologies Forum 2026 (DTF) held at COEX in Seoul, SK hynix showcased an AI memory portfolio spanning the full memory hierarchy, continuing its collaboration with strategic partner Dell.
Lam Research used SEMulator3D® integrated stress modeling to predict stress non-uniformity across GAA stacked nanosheet channels before fabrication — nFET stress differences reach 400–800 MPa, while pFET stays below 200 MPa. DOE experiments show that channel thickness, fin width, and lateral etch jointly affect stress uniformity, with increasing the topmost channel thickness from 4 nm to 7 nm significantly reducing the stress difference.
Hybrid bonding is becoming a key interconnect technology for next-generation products such as HBM, NAND, 3D-stacked DRAM and AI accelerators. It eliminates bumps and uses direct Cu–Cu bonding, shrinking chip pitch from about 100µm with solder balls and about 20µm with micro-bumps to under 1µm.
AMD announced it will be first to offer native UCIe 1.1 interface support in Versal adaptive SoCs, enabling low-power, high-bandwidth communication between adaptive SoCs and co-packaged specialty chiplets.
AMD announced that as of mid-2026 its AI energy efficiency improvement is estimated at 4x, exceeding the 3x expected for this phase, as it advances toward its 20x30 goal of a 20x improvement in rack-scale AI training and inference energy efficiency by 2030.
Intel announced a proposed $15 billion underwritten public offering of common stock, with net proceeds intended for general corporate purposes, including capital expenditures and working capital. The company said unprecedented investment in AI compute has created a strong demand environment, and it granted underwriters a 30-day option to purchase up to an additional $2.25 billion of stock, with J.P. Morgan, Goldman Sachs, Morgan Stanley and Citigroup acting as joint bookrunners.
Why it matters: The announcement details the offering size, use of proceeds and underwriting arrangements, letting readers see how Intel plans to fund capital expenditures tied to AI compute demand.
AMD announced on August 6 that it has reached a definitive agreement to acquire Taalas, a Toronto-based specialized AI inference chip company. Founded in 2023, Taalas develops technology that reduces the compute and memory bottlenecks of general-purpose architectures by optimizing inference data flow; AMD plans to integrate the technology into its accelerator roadmap and develop system-level solutions alongside AMD Instinct GPUs. The deal remains subject to regulatory approval.
On August 6, AMD announced a definitive agreement to acquire Taalas, a Toronto-based company founded in 2023 focused on dedicated AI inference chips. Taalas' technology optimizes inference data flow to reduce the compute and memory bottlenecks of general-purpose architectures; AMD plans to integrate it into its accelerator roadmap, co-develop system-level solutions with AMD Instinct GPUs, and fold it into its full-stack AI platform spanning the Helios rack solution, EPYC CPUs, and ROCm software.
Arista Networks reported Q2 2026 revenue of $3.036 billion, up 12.1% sequentially and 37.7% year over year, its first quarter above $3 billion; non-GAAP diluted EPS was $1.02, up 40% year over year.
Why it matters: The report gives specific figures for quarterly revenue, profit, and Q3 guidance, helping readers assess the pace of Arista's growth in AI networking hardware.
Marvell will showcase its AI memory and storage portfolio at FMS 2026 on August 4-6 at Booth #805, featuring PCIe 6.0 enterprise SSD controllers, CXL near-memory acceleration and memory pooling switches, CXL memory expansion cards, Octeon DPUs, and Photonic Fabric technology for optical interconnect scaling.
Intel reported Q2 2026 revenue of $16.1 billion, up 25% year over year, with non-GAAP EPS of $0.42 and a GAAP loss per share of $2.16.
Why it matters: The report also discloses segment revenue, 18A-P progress, and capacity expansion investment plans, helping readers compare growth structure against changes in capital spending.
At Advancing AI 2026 on July 23, AMD unveiled a full-stack AI and physical AI product portfolio, including its first rackscale solution, AMD Helios (72 Instinct MI455X GPUs plus 18 6th Gen EPYC "Venice" CPUs).
Why it matters: The official announcement consolidates Helios rack, MI400 series CPU/GPU spec figures, and major customer deployment plans, allowing readers to benchmark actual progress against competing solutions.
On July 23, 2026 at Advancing AI 2026, AMD and Cerebras announced a technical collaboration integrating AMD Helios rack-scale solutions with the Cerebras Wafer-Scale Engine into a single disaggregated inference workflow.
AMD and Anthropic announced a strategic partnership under which Anthropic will deploy up to 2GW of AMD Instinct MI450 series GPUs (including MI455X, paired with EPYC "Venice" CPUs, Pensando networking, and ROCm) in AMD Helios rackscale solutions, with the first 1GW starting deployment in the first half of 2027.
Why it matters: The official announcement gives the deployment scale, timeline, and equity investment amount, letting readers understand the full structure of the partnership.
AMD announced an expanded long-term strategic partnership with Microsoft, which will deploy the AMD Helios Rackscale Solution at scale on Azure for frontier model inference, its own AI customers, and Azure AI services.
Why it matters: The official announcement specifies the concrete vehicle and product composition of the partnership, helping readers understand how the two companies divide roles in AI infrastructure and the pace of deployment.
At the 2026 VLSI Symposium, Intel Foundry announced that Intel 18A-P has entered risk production, delivering 9% higher performance at the same power or 18% lower power at the same performance compared with Intel 18A, and is fully design-rule compatible with Intel 18A to reuse existing IP.
On June 9, 2026, Arista Networks launched the 7060XE7 series of 1.6T network platforms, positioned as a rack-scale AI infrastructure foundation. Built on 224G SerDes, the platforms deliver 100 Tbps of bandwidth, and LPO optical modules can cut interconnect power consumption by about 60%.
Intel announced a series of AI innovations at Computex 2026, spanning from chips to system-level solutions. Intel is working with SambaNova and Foxconn to build rack-scale AI inference infrastructure based on Xeon processors and the SambaNova SN-50 RDU.
Arista announced the launch of XPO high density liquid cooled pluggable optics. The original page body failed to load, so details such as specifications and availability cannot yet be verified.
Arista Networks (NYSE: ANET) reported fourth-quarter and full-year 2025 results: Q4 revenue of $2.488 billion, up 7.8% quarter over quarter and 28.9% year over year; full-year revenue of $9.006 billion, up 28.6% year over year.
Why it matters: The report discloses quarterly and annual revenue, margins, and Q1 2026 guidance, letting readers gauge the growth pace of its AI networking business.