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#光模块

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Oct 14Wed
  1. Semiconductor Engineering Chips and Packaging16

    Simplify Electronic-Photonic Design Workflows: eBook

    Semiconductor Engineering published an eBook on the natural evolution of EDA toward photonic device, circuit and system design methods. Driven by surging bandwidth demand, power and latency constraints, and the rapid adoption of silicon photonics, traditional EDA flows cannot handle photonics' complex physics and deep integration, and engineers need to move to electronic-photonic design automation (EPDA), a new design paradigm for delivering scalable, manufacturable optoelectronic systems.

Oct 12Mon
  1. Semiconductor Engineering Chips and Packaging44

    Startup Funding: Q3 2026

    In Q3 2026, 80 startups raised more than $8.5 billion combined, with two inference companies each raising $1 billion and nearly $7.5 billion going to 22 companies with rounds of $100 million or more. Investor focus centered on interconnect technology, networking chips and photonics, including co-packaged optics, millimeter-wave plastic waveguides, ferroelectric glass modulators and coherent DSPs for AI optics, while some companies explored replacing constrained HBM with ordinary DRAM or on-chip SRAM.

Oct 9Fri
  1. Semiconductor Engineering Chips and Packaging26

    Chip Industry Week In Review

    TSMC and GlobalFoundries signed a $2 billion agreement under which GlobalFoundries will manufacture silicon interposers for TSMC's CoWoS advanced packaging ecosystem at its Malta, New York plant, with volume production ramping in the first half of 2028.

Oct 8Thu
Oct 7Wed
  1. Semiconductor Engineering Chips and Packaging35

    Ultra-Compact Photonic Bends Reduce Loss While Meeting Foundry Rules (Georgia Tech)

    Georgia Tech researchers published an ultra-compact integrated photonic waveguide bend design method in Optics Letters, achieving low loss at an extremely small radius of 2.3 µm. The method introduces new contour constraints in a topology optimization framework, reducing sensitivity to manufacturing process variations while satisfying commercial foundry design rule checks, and has been experimentally validated.

Sep 21Mon
  1. Marvell Optical Interconnect and Official Announcements43

    Marvell to Showcase Industry-First 2nm Optical Technology Demos for AI Data Center Infrastructure at ECOC 2026

    Marvell will present industry-first 2nm optical interconnect demonstrations at ECOC 2026 in Malaga, Spain, September 20–24, 2026, including the first 2nm 400G/lane optical PAM4, the first 2nm 800G ZR/ZR+ pluggable modules with MACsec (driven by the Libra 2nm coherent DSP), and the first 2nm 1.6T ZR and coherent-lite O-band demos.

Sep 9Wed
Mar 12Thu