Marvell will present industry-first 2nm optical interconnect demonstrations at ECOC 2026 in Malaga, Spain, September 20–24, 2026, including the first 2nm 400G/lane optical PAM4, the first 2nm 800G ZR/ZR+ pluggable modules with MACsec (driven by the Libra 2nm coherent DSP), and the first 2nm 1.6T ZR and coherent-lite O-band demos.
TrendForce takes a deep dive into 3D advanced packaging and hybrid bonding: TSMC's SoIC uses 3D interconnect with 56x the interconnect density and 5x the energy efficiency of CoWoS, entered mass production in 2025 with a 6µm bond pitch, and plans to shrink to 4.5µm by 2029; Intel's Foveros Direct, at a 9µm pitch, enters mass production in 1H26 with the Clearwater Forest Xeon 6+.
Marvell announced it will showcase its AI data center connectivity and storage solution portfolio at AI Infra Summit 2026 (September 15–17, Santa Clara Convention Center, Booth #704).