GlobalFoundries will run two new fabs in Malta, New York, with investment of up to $21B; the first fab is expected to begin production in 2029. FormFactor and Teradyne will jointly develop test technologies for HBM and advanced packaging, with Teradyne investing $300M. CXMT plans to launch DDR5 server RDIMMs using 4F² DRAM cells by year-end; its EUV light source prototype has 90% localization but still needs three to five years before mass production.
Lam Research and imec are expanding their joint R&D collaboration with two new directions: advancing manufacturing readiness of 3D integration and advanced packaging, and advancing Aether® dry resist applications in imec's high-NA EUV research environment.
Semiconductor Engineering collects multiple recent chip technology papers, covering spatially deterministic nucleation of 2D semiconductors from KAIST and other institutions, the Hyper-NA EUV lithography system with a numerical aperture of at least 0.75 from Zeiss SMT and ASML, and BARE-AI from the University of Florida and others, which uses built-in performance monitors to defend against bit-flip attacks in AI hardware.
TSMC and GlobalFoundries signed a $2 billion agreement under which GlobalFoundries will manufacture silicon interposers for TSMC's CoWoS advanced packaging ecosystem at its Malta, New York plant, with volume production ramping in the first half of 2028.
Researchers at Carl Zeiss SMT and ASML published a paper proposing a Hyper-NA EUV lithography scheme with a numerical aperture of at least 0.75, as a path beyond today's 0.55 NA High-NA systems.
TrendForce launched Weekly Radar, a free subscription column that tracks supply and lead times for six component categories—GPU, DRAM, NAND, HDD, ABF, and MLCC—each week. The first issue notes the GPU is the only one of the six with lead times at balanced levels, while ABF lead times are 48-56 weeks, far above the balanced 12 weeks.