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Oct 15Thu
  1. Semiconductor Engineering Chips and Packaging46

    Agentic AI Alters The CPU-GPU Balance

    Agentic AI requires extensive if-then-else decision orchestration, work handled by CPUs; industry estimates suggest the CPU:GPU ratio could rise from roughly 1:4 in typical LLM scenarios to nearly 1:1, pushing up both CPU demand and prices.

Oct 14Wed
  1. Semiconductor Engineering Chips and Packaging22

    Blog Review: Oct. 14

    This blog review gathers several engineering articles: Synopsys explores how engineers' roles shift toward defining goals and evaluating trade-offs in autonomous workflows; Siemens explains how UALink over UCIe 3.0 enables cross-vendor interoperability through a standardized interface; Cadence covers GDDR7's channel operation, encoding and protection mechanisms; and Arm improves mobile toxicity speech detection using LiteRT, quantization, KleidiAI and SME2, reducing latency and server load.

Oct 13Tue
  1. Intel Official Announcements47

    Intel Accelerates Open Infrastructure for the Agentic AI Era

    At the OCP Global Summit, Intel detailed its GPU D-series (codenamed Crescent Island), built on the Xe3P architecture with up to 480 GB LPDDR5X memory, 1.5 TB/s memory bandwidth and 1.3 petaflops of FP8 compute at 350 watts; a single card supports 300-billion-parameter models and an 8-card system supports over 1 trillion parameters.

Oct 12Mon
  1. NVIDIA Blog63

    OCP Global Summit: Amid Ecosystem Adoption, NVIDIA Opens Vera Rubin Architecture to Help Scale AI Factories Worldwide

    At the OCP Global Summit, NVIDIA announced it is contributing Vera Rubin rack and compute tray designs to the OCP through its MGX open architecture. The MGX 1.2 spec adds rack-level blind-mate liquid cooling, a 5000A liquid-cooled busbar, and support for rack deployments of up to 250kW.

    Why it matters: The piece collects multiple open specifications such as MGX 1.2 and Open Data Center Specification v0.7, along with accompanying software, giving readers a view into the open foundations of AI factories.

Oct 11Sun
Oct 9Fri
Oct 5Mon
  1. AMD Chips and Compute14

    AMD Helios: Designing and Building the Future of AI Infrastructure (Videos)

    AMD has released video resources related to AMD Helios AI infrastructure, along with brand assets including AMD trademarks and logos for download. Before downloading, users must accept terms and conditions: these AMD Marks may only be used in promotional materials featuring products with AMD CPUs, GPUs, APUs or FPGAs, and AMD may terminate the license at any time.

Oct 3Sat
  1. Ars Technica · AI68

    US arrests tech CEO accused of smuggling $300M in Nvidia chips into China

    The US Department of Justice arrested Greg Lui, 38, CEO of Earthmade Computer, alleging that from October 2023 to August 2026 he used falsified documents to ship servers containing export-controlled Nvidia A100 and H100 GPUs through freight forwarders in Malaysia, Singapore and elsewhere, ultimately diverting them to a company in Hangzhou, China, in a scheme worth over $300 million.

Sep 22Tue
  1. TrendForce Insights Semiconductor Industry Insights67

    By 2028, US Data Centers Could Have the Servers but Not the Power to Run Them

    Based on AI server shipments, TrendForce projects that global data center power demand capacity will reach 490.7GW by 2030, with the US at 272.4GW, while US grid deliverable capacity will be only 100.7GW, leaving a gap of more than 170GW, of which about 49GW stems from the grid being unable to deliver on schedule.

Sep 17Thu
  1. AMD Chips and Compute26

    Building Infrastructure for an AI World in Motion

    At the AI Infra Summit, AMD argued that the core of AI infrastructure design should not be chips or networking but a system's ability to adapt to changing demands. The piece notes that agentic AI turns a single request into a multi-step chain of retrieval, tool calls, code execution and sub-agent coordination, and should be measured by cost per completed task rather than cost per token, offering three auditable principles: adaptable, economical, and open.

Aug 31Mon
Aug 10Mon
  1. TrendForce Insights Semiconductor Industry Insights44

    China's Aggressive Push for High-End AI Chip Autonomy

    TrendForce supply chain research shows that despite reports China may relax import restrictions on the NVIDIA H200, actual H200 entry into China remains highly uncertain. Under export controls on high-end GPUs, the Chinese government is actively promoting domestic AI chip adoption this year, and the local ecosystem is gradually maturing in advanced process nodes, advanced packaging, and thermal management. China's AI infrastructure is shifting from reliance on foreign GPUs toward a dual-track model of domestic GPUs plus in-house ASICs.

Aug 7Fri
  1. AMD Official Announcements54

    AMD Acquires Taalas to Advance Compute Solutions for Rapidly Growing AI Inference Market

    AMD announced on August 6 that it has reached a definitive agreement to acquire Taalas, a Toronto-based specialized AI inference chip company. Founded in 2023, Taalas develops technology that reduces the compute and memory bottlenecks of general-purpose architectures by optimizing inference data flow; AMD plans to integrate the technology into its accelerator roadmap and develop system-level solutions alongside AMD Instinct GPUs. The deal remains subject to regulatory approval.

Aug 5Wed
  1. AMD Official Announcements75

    AMD Reports Second Quarter 2026 Financial Results

    AMD reported Q2 2026 results with revenue of $11.5 billion, up 50% year over year, GAAP net income of $2.3 billion, and data center revenue of $6.7 billion, up 107% and accounting for 58% of total revenue.

    Why it matters: The earnings report gives specific figures on doubled data center revenue, AI-related product deployments and next-quarter guidance, helping readers gauge the pace of AMD's AI business growth.

Jul 24Fri
  1. AMD Official Announcements69

    AAI 2026: AMD Delivers Full-Stack Compute for the Agentic AI Era

    At Advancing AI 2026 on July 23, AMD unveiled a full-stack AI and physical AI product portfolio, including its first rackscale solution, AMD Helios (72 Instinct MI455X GPUs plus 18 6th Gen EPYC "Venice" CPUs).

    Why it matters: The official announcement consolidates Helios rack, MI400 series CPU/GPU spec figures, and major customer deployment plans, allowing readers to benchmark actual progress against competing solutions.

Jun 17Wed
Jun 2Tue