先进封装从工艺学习到量产控制：表征与测试的挑战与方法
From Process Learning To Production Control: Trends In Advanced Packaging And Implications To Characterization And Test
随着异构集成从 2.5D interposer、CoWoS 发展到混合键合与 3D 堆叠，先进封装的良率敏感性和缺陷机制与前端逻辑及标准封装截然不同，行业一直缺乏专用计量、表征与分析框架。文章介绍一套集成方法论，用于加速先进封装工艺开发并维持量产控制。
An integrated methodology for accelerating process development and sustaining production control for advanced packaging technologies.
The explosive growth of heterogeneous integration, from 2.5D interposers and CoWoS to hybrid bonding and 3D stacking, is redefining what it means to “ramp a process.” Advanced packaging technologies exhibit yield sensitivities and defect mechanisms fundamentally different from front-end logic or standard packaging technology, yet the industry has lacked purpose-built metrology, characterization, and analytics frameworks to address these new challenges at scale. This presentation explains an integrated methodology for accelerating process development and sustaining production control for advanced packaging technologies.
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来源：Semiconductor Engineering 芯片与封装 · semiengineering.com