UCIe 在 2.5D 与 3D 多芯片设计中的互连差异与工程考量
UCIe Connectivity for 2.5D and 3D Multi-Die Designs
一份白皮书分析了 UCIe die-to-die 互连在 2.5D 和 3D 多芯片设计中的差异与工程考量。2.5D 封装中 UCIe 链路经过封装信道，受插入损耗、串扰和数据速率提升影响 PHY 与封装设计；3D 设计则借助更短的垂直连接和细间距键合，通过连接密度扩展带宽，减少高速串行化、均衡和信道训练需求。
The differences and engineering considerations behind choosing and implementing UCIe connectivity for advanced multi-die designs.
UCIe provides a common standard for die-to-die connectivity, but connecting dies in a 2.5D package is fundamentally different from connecting them in a 3D design.
In 2.5D designs, UCIe links traverse package channels where insertion loss, crosstalk, and increasing data rates influence PHY and package design. In 3D designs, shorter vertical connections and fine-pitch bonding allow bandwidth to scale through connection density, reducing the need for high-speed serialization, equalization, and channel training.
This white paper examines those differences and the engineering considerations behind choosing and implementing UCIe connectivity for advanced multi-die designs.
What you’ll learn:
- How UCIe connectivity differs across 2.5D and 3D designs
- How F2B and F2F topologies affect interface design
- How 3D integration changes implementation, test, and reliability requirements
- How to align UCIe IP, package topology, and implementation strategy
Read more here.
来源： Semiconductor Engineering 芯片与封装 · semiengineering.com