芯片行业技术论文集锦：HBM 功耗、GAAFET 漏电路径与 Agentic AI 芯片设计
Chip Industry Technical Paper Roundup: Oct. 20
Semiconductor Engineering 收录多篇新芯片技术论文：Argonne 国家实验室与伊利诺伊大学厄巴纳-香槟分校研究跨芯片、scale-up 与 scale-out 域的 agentic AI 异构系统设计；Sandia 国家实验室用第一性原理模拟揭示 GAAFET 新漏电路径。
HBM power consumption; GAAFET leakage pathways; agentic AI for heterogeneous system design; nanoelectromechanical gain-cell eDRAM; AI-accelerated 3D-IC thermal modeling; agentic AI for RTL verification and debugging; thermal side-channel attacks in autonomous vehicles.
New technical papers recently added to Semiconductor Engineering’s library:
| Technical Paper | Research Organizations |
|---|---|
| Agentic AI for Heterogeneous System Design Across Chip, Scale-Up, and Scale-Out Domains | Argonne National Laboratory, University of Illinois Urbana-Champaign |
| Revealing New Leakage Paths in GAAFETs using Predictive First-Principles Simulations | Sandia National Laboratories, Luxembourg Institute of Science and Technology |
| Nanoelectromechanically Gated Gain Cell eDRAM | UC Berkeley, Samsung Electronics, Intel |
| A Composable AI-Accelerated Iterative Solver for 3D-IC Thermal Modeling | Cadence Design Systems, University of Notre Dame |
| Understanding the Power Consumption of Modern High Bandwidth Memory: Experimental Analysis and Modeling Using Real HBM2 DRAM Chips | ETH Zürich, New York University |
| Back to the Future: Rethinking EDA Infrastructure for Agentic Systems in Chip Design Verification | Columbia University, Google DeepMind, Google |
| Can Autonomous Vehicles Keep Their Cool? A Survey of Thermal Side-Channel and Perception Attacks | Missouri University of Science and Technology |
Find more semiconductor research papers here.
Linda Christensen
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Linda Christensen is vice president of operations and a contributing writer at Semiconductor Engineering.
来源： Semiconductor Engineering 芯片与封装 · semiengineering.com