Siemens Innovator3D IC：从硅中介层到系统级签核的 3D-IC 信号完整性方案
3D-IC Signal Integrity: From Silicon Interposers To System Signoff
Siemens 的 Innovator3D IC 提供统一的系统级环境，覆盖架构探索、电磁提取、信道仿真、协议合规验证到最终系统级签核的完整流程。随着 AI 与 HPC 架构基于先进平台采用 chiplet 设计，信号完整性需从元件级验证演进到全系统级信道分析。该方案将多项已验证技术整合为无缝工作流，应对 3D-IC 的复杂性。
A unified, system-level environment that aggregates several proven technologies into a seamless workflow spanning architecture exploration, electromagnetic extraction, channel simulation, protocol compliance verification, and final system-level signoff.
As AI and HPC architectures adopt chiplet designs built on advanced platforms, signal integrity must evolve from component-level validation to full system-level channel analysis. Siemens’ Innovator3D IC addresses these complexities by providing a unified, system-level environment that aggregates several proven technologies into a seamless workflow spanning architecture exploration, electromagnetic extraction, channel simulation, protocol compliance verification, and final system-level signoff.
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来源： Semiconductor Engineering 芯片与封装 · semiengineering.com