Memory supply tightness will persist through 2027, with DRAM lead times at 20 weeks versus a balanced level of 8 weeks; vendors are shifting PC DRAM capacity to server DRAM, and HDD lead times remain at 50 weeks.
TSMC and GlobalFoundries signed a $2 billion agreement under which GlobalFoundries will manufacture silicon interposers for TSMC's CoWoS advanced packaging ecosystem at its Malta, New York plant, with volume production ramping in the first half of 2028.
Nous Research announced a $90 million Series B at a $1.5 billion valuation, led by Robot Ventures with Nvidia, Union Square Ventures, Menlo Ventures, Samsung and 1789 Capital participating, bringing total funding to $158 million.
NAND suppliers are shifting capacity toward enterprise SSDs on recovering demand, but eSSD lead times still stretch to 16 weeks, far above the 8 weeks of a balanced market, and overall supply remains insufficient. Other highlights this week include reports that SK hynix is in early talks with Intel about producing memory chips in the US, and Huawei moving its Ascend 960DT up three quarters to early 2027 to catch up with NVIDIA.
As test-time scaling rises, the AI industry's focus is shifting from training to inference, bringing structural changes to the memory hierarchy. In the first half of 2026, NVIDIA and Google respectively launched CMX, Rubin integrated Groq LPX, and the TPU v8i designed for inference (with 72 GB more HBM3e and 384 MB SRAM than the TPU v8t).