SK hynix presented several next-generation memory solutions for AI servers at OCP Global Summit 2026, held October 12–15 in San Jose.
Marvell, Microsoft, and Oracle announced a new working group under the Open Compute Project (OCP) Security track, aiming to standardize integrated HSMs for cloud and hyperscale data centers at NIST FIPS 140-3 Level 3.
Marvell has launched its second-generation Structera X 3406 and 3506 CXL 3.2 memory expanders, built on an industry-first six-channel DDR4/DDR5 design that increases channel count by 50% over the previous generation, supports PCIe Gen 6, and allows a single controller to support up to 9TB DDR4 or 6TB DDR5.
AMD launched the Helion agentic AI rack-scale solution, an open blueprint for agentic AI infrastructure designed based on OCP specifications.
AMD has launched the AMD Helion agentic AI rack, an open blueprint for agentic AI infrastructure designed to Open Compute Project specifications and powered by AMD compute.
Marvell will present industry-first 2nm optical interconnect demonstrations at ECOC 2026 in Malaga, Spain, September 20–24, 2026, including the first 2nm 400G/lane optical PAM4, the first 2nm 800G ZR/ZR+ pluggable modules with MACsec (driven by the Libra 2nm coherent DSP), and the first 2nm 1.6T ZR and coherent-lite O-band demos.
During LEAP 2026, AMD announced that AI infrastructure built with Cisco and HUMAIN, based on AMD Instinct MI355X GPUs, EPYC CPUs and Cisco networking equipment, is now in production service, with plans to add up to 250 megawatts starting from 2027 and the joint venture on track to reach up to 1 gigawatt by 2030.
AMD claims that 14 EPYC 9965 servers can replace 100 dual-socket Intel Xeon Platinum 8280 servers aged 5-7 years, cutting server count by 86% while delivering the same total performance, reducing power consumption by 69% and three-year TCO by 41%.
Lam Research has broken ground on a new laboratory expansion at its R&D center in Tualatin, Oregon. Once complete, the facility will add 120,000 square feet, expanding cleanroom space by more than 50%, with operation expected in 2028.
AMD announced that as of mid-2026 its AI energy efficiency improvement is estimated at 4x, exceeding the 3x expected for this phase, as it advances toward its 20x30 goal of a 20x improvement in rack-scale AI training and inference energy efficiency by 2030.
AMD released its 2025-26 Corporate Responsibility Report, reviewing progress on 2020-2025 goals and looking ahead to 2030. From 2020 to 2025, renewable electricity rose from 22% to 58%, operational greenhouse gas emissions fell 30%, AI training and high-performance computing node energy efficiency improved 38x, and AMD systems on the Green500 list grew from 11 to 194; new targets include a 20x improvement in rack-scale AI energy efficiency from 2024 to 2030.
Intel announced a series of AI innovations at Computex 2026, spanning from chips to system-level solutions. Intel is working with SambaNova and Foxconn to build rack-scale AI inference infrastructure based on Xeon processors and the SambaNova SN-50 RDU.