imec 研究垂直堆叠 DRAM 的热设计空间，超越 HBM-on-GPU
Vertical DRAM Stacking Expands Thermal Design Space Beyond HBM-on-GPU (imec)
imec 研究人员发表论文"Beyond HBM-on-GPU: Thermal Design Envelope for 3D Volumetric DRAM-on-GPU Integration"，评估将 DRAM 裸片垂直旋转堆叠在 GPU 上方并在其间设置冷却腔的 3D 内存架构，作为传统 2.5D HBM 和 HBM-on-GPU 直接堆叠的替代方案。
Researchers at imec published “Beyond HBM-on-GPU: Thermal Design Envelope for 3D Volumetric DRAM-on-GPU Integration.”
Summary:
Researchers evaluated a 3D memory architecture that rotates DRAM dies vertically above a GPU and places cooling cavities between them as an alternative to conventional 2.5D HBM and direct-stacked HBM-on-GPU. Package-level thermal simulations examined stack height, memory capacity and organization, cooling-cavity materials, stack orientation, mold insertion, and the addition of a distributed memory-controller/network-on-chip tier.
Find the technical paper here. September 2026
Chen, Yukai, Melina Lofrano, Khakim Akhunov, Jonas Svedas, Arjun Singh, Nathan Laubeuf, Diksha Moolchandani et al. “Beyond HBM-on-GPU: Thermal Design Envelope for 3D Volumetric DRAM-on-GPU Integration.” arXiv preprint arXiv:2609.24343 (2026).
来源： Semiconductor Engineering 芯片与封装 · semiengineering.com