TrendForce Insights 半导体产业洞察· TrendForce·· 4 小时前AI 评分58
NVIDIA 计划三年内与供应链伙伴将载板产能提升至 2.5 倍
Weekly Radar 007: NVIDIA Moves to Secure Substrate Capacity
AI 导读
TrendForce 报道 ABF 载板仍是 AI 供应链最紧张的环节之一，交期维持在 48–56 周，而供需平衡市场约为 12 周，短期内难有缓解。NVIDIA 计划在未来三年与供应链伙伴合作，将其产品所需的载板产能提升至 2.5 倍。
正文 · 原文
ABF remains one of the tightest links in the AI supply chain. Lead times stay at 48–56 weeks versus 12 weeks in a balanced market, with little near-term relief. NVIDIA plans to increase substrate capacity for its products by 2.5x over the next three years with its supply chain partners, underscoring how persistent the constraint h…
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来源： TrendForce Insights 半导体产业洞察 · insights.trendforce.com