Semiconductor Engineering 芯片与封装· Linda Christensen·· 4 小时前AI 评分21
芯片行业技术论文精选（11 月 3 日）
Chip Industry Technical Paper Roundup: Nov. 3
AI 导读
Semiconductor Engineering 新收录一批技术论文，涵盖 IBM Research 的米级量子处理器互联、imec 与 Vrije Universiteit Brussel 的 2.5D/3D 小芯片 GPU 碳排放研究。
正文 · 原文
Meter-scale quantum interconnects; 2.5D/3D GPU integration and embodied emissions; secure memory-dependent prefetching; routing-aware analog placement; AI-enhanced flip-chip defect detection; superposed PCM for neural-network vector storage.
New technical papers recently added to Semiconductor Engineering’s library:
| Technical Paper | Research Organizations |
|---|---|
| Meter-scale quantum interconnects between large quantum processors | IBM Research |
| Embodied Emissions of 2.5D and 3D Scaling in Chipletized GPUs for Low-Carbon AI | imec, Vrije Universiteit Brussel |
| SecDMP: Provably Secure Data Memory-Dependent Prefetching | KU Leuven, EURECOM |
| APPlace: Co-Optimizing Device Locations and Access Points for Routing-Aware Analog Placement | UT Austin |
| AI-Based Image Enhancement Improves Detection of Interconnect Defects in Microelectronic Packaging | Materials Center Leoben, PVA TePla, ASE |
| Superposed analog memory for vector storage in neural networks | IBM Research Europe |
Find more semiconductor research papers here.
Linda Christensen
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Linda Christensen is vice president of operations and a contributing writer at Semiconductor Engineering.
来源： Semiconductor Engineering 芯片与封装 · semiengineering.com