TrendForce Insights 半导体产业洞察· TrendForce·· 5 小时前AI 评分43
TrendForce 周报 008：DRAM 紧张按容量分化，32GB/64GB RDIMM 最紧
Weekly Radar 008: DRAM Tightness Splits by Capacity
AI 导读
TrendForce 本周半导体供应链周报显示，GPU 从供需平衡转向紧张，MLCC 交期延长至 38 周，DRAM 交期缩短至 19 周但仍属非常紧缺，其中 32GB/64GB RDIMM 最为吃紧。存储供应商正录得创纪录利润，而其最大客户则面临现金流出增加的压力。
正文 · 原文
This week’s radar shows mixed moves. GPU shifts from Balanced to Tightening, MLCC lead times extend to 38 weeks, and DRAM eases to 19 weeks but remains Very Tight, especially for 32GB/64GB RDIMMs.
Memory suppliers are posting record profits while their largest customers face rising cash outflows. Samsung and SK hynix reported recor…
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来源： TrendForce Insights 半导体产业洞察 · insights.trendforce.com