Calibre DE-Via：左移式过孔插入方法
Shift-Left DE-Via
Siemens 的 Calibre DesignEnhancer Via（DE-Via）通过自动化插入冗余过孔，应对物理设计中的过孔电阻、电迁移和布线密度问题，并保证布局修改 DRC 无违规。该左移方法在设计早期提升过孔鲁棒性，减少后期 signoff 迭代，同时识别易短路区域并避开插入，以保持生产效率和问题可见性。
Calibre-aware, short-resilient via insertion for signoff-ready physical design.
Physical design teams face challenges with via resistance, electromigration and routing density. Calibre DesignEnhancer Via (DE-Via) automates the insertion of additional vias, ensuring DRC-clean layout modifications.
This shift-left methodology improves via robustness early in the design cycle, reducing late signoff iterations. DE-Via identifies short-prone regions, avoiding insertion in those areas to maintain productivity and visibility into unresolved issues.
What you’ll learn:
- How automated via insertion improves interconnect robustness
- The benefits of a shift-left methodology in physical design
- How DE-Via identifies and avoids short-prone regions
- The integration of DE-Via into existing design flows
- Practical benefits of short-resilient handling in via optimization
Who should read this:
- Physical design engineers
- CAD engineers
- Design implementation teams
- Anyone involved in advanced node physical design
To learn more, click here.
来源： Semiconductor Engineering 芯片与封装 · semiengineering.com