TSMC and GlobalFoundries signed a $2 billion agreement under which GlobalFoundries will manufacture silicon interposers for TSMC's CoWoS advanced packaging ecosystem at its Malta, New York plant, with volume production ramping in the first half of 2028.
Nous Research announced a $90 million Series B at a $1.5 billion valuation, led by Robot Ventures with Nvidia, Union Square Ventures, Menlo Ventures, Samsung and 1789 Capital participating, bringing total funding to $158 million.
NAND suppliers are shifting capacity toward enterprise SSDs on recovering demand, but eSSD lead times still stretch to 16 weeks, far above the 8 weeks of a balanced market, and overall supply remains insufficient. Other highlights this week include reports that SK hynix is in early talks with Intel about producing memory chips in the US, and Huawei moving its Ascend 960DT up three quarters to early 2027 to catch up with NVIDIA.