Dry-Deposited Resist Shows Different Tone Behavior Under EUV And E-Beam Exposure (KU Leuven, Kunsan, VUB, Imec)
Dry-Deposited Resist Shows Different Tone Behavior Under EUV And E-Beam Exposure (KU Leuven, Kunsan, VUB, Imec)
Researchers from KU Leuven, Kunsan National University, Vrije Universiteit Brussel and imec, among other institutions, have published a paper in ACS Applied Materials & Interfaces reporting a fully dry-deposited halogenated amorphous zeolitic imidazolate framework (a-ZIF) metal-organic photoresist for advanced patterning in next-generation semiconductor manufacturing. The resist exhibits pronounced, exposure-source-dependent tone-switching behavior under both electron-beam and EUV exposure.
Researchers at KU Leuven, Kunsan National University, Vrije Universiteit Brussel, imec, et al. published “Irradiation-Source-Dependent Tone Conversion in Dry-Deposited Halogenated Amorphous Zeolitic Imidazolate Framework Resists for Electron-Beam and Extreme Ultraviolet Lithography.”
Abstract Excerpt:
“Dry-deposited metal–organic resists are key enablers for advanced patterning processes in next-generation semiconductor manufacturing. Here, we report halogenated amorphous zeolitic imidazolate framework (a-ZIF) resists deposited entirely by a dry process, which exhibit a pronounced irradiation-source-dependent tone conversion.”
Find the technical paper here. October 2026.
Byeon, Jinhwan, Nick Gys, Jorid Smets, Ali Azimi, Lukas Nulens, João Fernandes, Leen Boullart et al. “Irradiation-Source-Dependent Tone Conversion in Dry-Deposited Halogenated Amorphous Zeolitic Imidazolate Framework Resists for Electron-Beam and Extreme Ultraviolet Lithography.” ACS Applied Materials & Interfaces (2026).
Source: Semiconductor Engineering Chips and Packaging · semiengineering.com