From Process Learning To Production Control: Trends In Advanced Packaging And Implications To Characterization And Test
From Process Learning To Production Control: Trends In Advanced Packaging And Implications To Characterization And Test
As heterogeneous integration evolves from 2.5D interposers and CoWoS to hybrid bonding and 3D stacking, the yield sensitivity and defect mechanisms of advanced packaging differ sharply from front-end logic and standard packaging, and the industry has long lacked dedicated metrology, characterization and analysis frameworks. The article presents an integrated methodology to accelerate advanced packaging process development and sustain production control.
An integrated methodology for accelerating process development and sustaining production control for advanced packaging technologies.
The explosive growth of heterogeneous integration, from 2.5D interposers and CoWoS to hybrid bonding and 3D stacking, is redefining what it means to “ramp a process.” Advanced packaging technologies exhibit yield sensitivities and defect mechanisms fundamentally different from front-end logic or standard packaging technology, yet the industry has lacked purpose-built metrology, characterization, and analytics frameworks to address these new challenges at scale. This presentation explains an integrated methodology for accelerating process development and sustaining production control for advanced packaging technologies.
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Source: Semiconductor Engineering Chips and Packaging · semiengineering.com