3D-IC Signal Integrity: From Silicon Interposers To System Signoff
3D-IC Signal Integrity: From Silicon Interposers To System Signoff
Siemens' Innovator3D IC offers a unified system-level environment covering the full flow from architecture exploration, electromagnetic extraction, channel simulation, and protocol compliance verification to final system-level signoff. As AI and HPC architectures adopt chiplet designs on advanced platforms, signal integrity must evolve from component-level verification to full system-level channel analysis. The solution integrates multiple proven technologies into a seamless workflow to handle 3D-IC complexity.
A unified, system-level environment that aggregates several proven technologies into a seamless workflow spanning architecture exploration, electromagnetic extraction, channel simulation, protocol compliance verification, and final system-level signoff.
As AI and HPC architectures adopt chiplet designs built on advanced platforms, signal integrity must evolve from component-level validation to full system-level channel analysis. Siemens’ Innovator3D IC addresses these complexities by providing a unified, system-level environment that aggregates several proven technologies into a seamless workflow spanning architecture exploration, electromagnetic extraction, channel simulation, protocol compliance verification, and final system-level signoff.
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Source: Semiconductor Engineering Chips and Packaging · semiengineering.com