Siemens Launches Unified Signoff Environment for 3D-IC Signal Integrity
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Siemens has launched Innovator3D IC, providing a unified system-level environment covering the complete flow from architecture exploration, electromagnetic extraction, and channel simulation to protocol compliance verification and final system-level signoff. As AI and HPC architectures adopt chiplet designs on advanced platforms, signal integrity verification must evolve from component-level to full system-level channel analysis. The solution integrates multiple proven technologies into a seamless workflow to address the complexity of 3D-IC design, delivering a signal integrity solution from silicon interposer to system-level signoff.
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- Semiconductor Engineering Chips and Packaging3D-IC Signal Integrity: From Silicon Interposers To System Signoff
Siemens' Innovator3D IC offers a unified system-level environment covering the full flow from architecture exploration, electromagnetic extraction, channel simulation, and protocol compliance verification to final system-level signoff. As AI and HPC architectures adopt chiplet designs on advanced platforms, signal integrity must evolve from component-level verification to full system-level channel analysis. The solution integrates multiple proven technologies into a seamless workflow to handle 3D-IC complexity.
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