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#光刻机

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Oct 13Tue
  1. Semiconductor Engineering Chips and Packaging29

    Chip Industry Technical Paper Roundup: Oct. 13

    Semiconductor Engineering collects multiple recent chip technology papers, covering spatially deterministic nucleation of 2D semiconductors from KAIST and other institutions, the Hyper-NA EUV lithography system with a numerical aperture of at least 0.75 from Zeiss SMT and ASML, and BARE-AI from the University of Florida and others, which uses built-in performance monitors to defend against bit-flip attacks in AI hardware.