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#TSMC

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Oct 9Fri
  1. Semiconductor Engineering Chips and Packaging26

    Chip Industry Week In Review

    TSMC and GlobalFoundries signed a $2 billion agreement under which GlobalFoundries will manufacture silicon interposers for TSMC's CoWoS advanced packaging ecosystem at its Malta, New York plant, with volume production ramping in the first half of 2028.

Sep 28Mon
  1. TrendForce Insights Semiconductor Industry Insights39

    Weekly Radar 003: Meta's Muse Puts Server CPUs Back in Focus

    TrendForce's weekly radar focuses on server CPUs: agentic AI has pushed lead times to 25–30 weeks, well above the balanced level of 16–20 weeks. Meta's AI agent Muse reportedly surpassed ChatGPT in downloads early after launch, driving AMD's market cap past $1 trillion for the first time, and at Connect 2026 Meta unveiled the Meta Charm handheld device powered by Muse.