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#算力基础设施

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Oct 15Thu
  1. Latent Space51

    [AINews] Modal’s $1B ARR, $16B Series D makes it NYC’s newest AI Infra Decacorn, 3x usage and 3x valuation in 5 months, 15x in 1 yr

    Modal announced its annualized revenue has surpassed $1 billion and it raised a $750 million Series D led by Accel at a $15.75 billion valuation. Usage has tripled since its Series C, growing more than 15x year over year. Sandboxes, launched in 2023, alone has reached $300 million in annualized revenue, with nearly 3 billion sandboxes launched cumulatively and the ability to scale to millions running concurrently.

Oct 14Wed
Oct 13Tue
Oct 10Sat
  1. Ars Technica · AI55

    Ukraine’s drones knock out AI data center belonging to "Russia’s Google"

    A Ukrainian drone strike destroyed an AI data center belonging to Yandex, known as "Russia's Google"; per Reuters, other affected Russian services include a dating app, a real estate aggregator, a self-publishing platform, and a Russian Premier League football club's website. The report notes data centers are becoming war targets in 2026, after Iranian drones destroyed multiple Amazon data centers in Bahrain and the UAE following the February US-Israel strikes on Iran.

Oct 8Thu
Oct 3Sat
Oct 2Fri
Sep 28Mon
  1. AMD Chips and Compute78

    AMD to Acquire World Labs to Advance the Future of AI Compute

    AMD announced a definitive agreement to acquire World Labs in an all-stock deal valued at approximately $8.2 billion, expected to close by the end of 2026, subject to regulatory approval and other customary closing conditions. Founded by Fei-Fei Li and headquartered in San Francisco, World Labs develops spatial intelligence models that generate, reconstruct, and simulate interactive 3D environments from text, image, and video inputs, as well as robot learning and simulation technology.

    Why it matters: AMD's official announcement gives the deal amount, equity form, and timeline, helping readers understand its direction of integrating AI hardware with model research.

Sep 22Tue
  1. TrendForce Insights Semiconductor Industry Insights67

    By 2028, US Data Centers Could Have the Servers but Not the Power to Run Them

    Based on AI server shipments, TrendForce projects that global data center power demand capacity will reach 490.7GW by 2030, with the US at 272.4GW, while US grid deliverable capacity will be only 100.7GW, leaving a gap of more than 170GW, of which about 49GW stems from the grid being unable to deliver on schedule.

Sep 9Wed
Aug 19Wed
  1. AMD Chips and Compute24

    Secihti and AMD to Develop AI and Supercomputing Talent in Mexico

    Mexico's Ministry of Science, Humanities, Technology and Innovation (Secihti) has signed a memorandum of understanding with AMD aimed at building a national innovation ecosystem spanning AI, high-performance computing and semiconductors. The two sides will coordinate academic activities, seminars and training programs to develop skilled talent. The partnership will also support projects such as the Coatlicue supercomputer and national HPC and AI clusters, strengthening Mexico's research infrastructure and technological sovereignty.

Aug 18Tue
  1. AMD Chips and Compute27

    Scaling Impact: 2025-26 Corporate Responsibility Report

    AMD released its 2025-26 Corporate Responsibility Report, reviewing progress on 2020-2025 goals and looking ahead to 2030. From 2020 to 2025, renewable electricity rose from 22% to 58%, operational greenhouse gas emissions fell 30%, AI training and high-performance computing node energy efficiency improved 38x, and AMD systems on the Green500 list grew from 11 to 194; new targets include a 20x improvement in rack-scale AI energy efficiency from 2024 to 2030.

Aug 6Thu
  1. AMD Chips and Compute58

    AMD Acquires Taalas to Advance Compute Solutions for Rapidly Growing AI Inference Market

    On August 6, AMD announced a definitive agreement to acquire Taalas, a Toronto-based company founded in 2023 focused on dedicated AI inference chips. Taalas' technology optimizes inference data flow to reduce the compute and memory bottlenecks of general-purpose architectures; AMD plans to integrate it into its accelerator roadmap, co-develop system-level solutions with AMD Instinct GPUs, and fold it into its full-stack AI platform spanning the Helios rack solution, EPYC CPUs, and ROCm software.