Teradyne System-Level Test Platform Targets AI and Data Center Chips
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On October 8, 2026, Semiconductor Engineering reported that Ben Mitchel, Senior Director of Integrated System Test at Teradyne, explained why system-level test has become critical in the volume production of AI and data center equipment. According to him, these devices use multi-chiplet designs with power consumption in the thousands of watts and must be tested under real-world conditions. To meet this need, Teradyne launched the Titan HP platform, which provides the power, thermal management, and throughput such devices require, supporting system-level volume production testing of AI and data center chips.
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- Semiconductor Engineering Chips and PackagingPerspectives On Test: System Level Test For AI & Data Centers
Ben Mitchel, senior director of Teradyne's Integrated System Test division, explains why system-level test has become critical for mass production of AI and data center equipment. These devices use multi-chiplet designs and draw thousands of watts, requiring testing under real-world conditions. The Titan HP platform delivers the power, thermal management, and throughput such devices demand.