Semiconductor Engineering Continuously Collecting Chip Technology Papers
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Semiconductor Engineering continuously collects technical papers from the chip industry, maintaining a curated papers section. On November 3, 2026, the section added a new batch of technical papers, covering IBM Research's work on meter-scale quantum processor interconnects, as well as research on the carbon emissions of 2.5D/3D chiplet-based GPUs conducted by imec in collaboration with Vrije Universiteit Brussel. The section is still being continuously updated, and no further reports on this event are available.
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- Semiconductor Engineering Chips and PackagingChip Industry Technical Paper Roundup: Nov. 3
Semiconductor Engineering has added a batch of technical papers, covering IBM Research's meter-scale quantum processor interconnects and a 2.5D/3D chiplet GPU carbon emissions study by imec and Vrije Universiteit Brussel.
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