HBM supply shortage persists: SK hynix and Samsung sold out through 2027–2029, TSMC mulls CoWoS price hike
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Semiconductor Engineering's chip industry weekly report published on October 30 summarized recent developments in memory and packaging supply tightness. SK hynix expects DRAM and HBM supply to remain tight through 2030, with products effectively sold out through 2029; Samsung said its HBM supply for 2027 is also sold out. Meanwhile, TSMC is reportedly considering a 20% price increase for its CoWoS advanced packaging. The report noted that the HBM shortage is threatening AI expansion, and the supply arrangements and price moves of these companies reflect continued supply shortfalls in TSMC's advanced packaging and memory segments.
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- Semiconductor Engineering Chips and PackagingChip Industry Week In Review
Semiconductor Engineering rounds up the week's chip industry news: SK hynix expects DRAM and HBM supply to stay tight through 2030, with products effectively sold out through 2029; Samsung says its 2027 HBM supply is sold out; and TSMC is reportedly considering a 20% price increase for CoWoS.
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