Chip Industry Weekly: CHIPS Act Funding and Memory Roadmap Updates
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The chip industry saw multiple developments this week. The U.S. Department of Commerce signed preliminary memoranda of terms with four companies—Helion, Commonwealth Fusion Systems, Vertical Semiconductor, and Sibelco—for up to $389 million in CHIPS Act R&D funding, covering vertical GaN and ultrapure quartz technologies. In addition, this week's industry coverage also included Micron's memory roadmap, Nvidia's supply chain capacity expansion, and Tenstorrent completing a $1.5 billion funding round, together reflecting the industry's continued investment in advanced packaging, memory technology upgrades, and supply chain capacity expansion.
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- Semiconductor Engineering Chips and PackagingChip Industry Week In Review
The U.S. Department of Commerce signed preliminary memoranda of terms with Helion, Commonwealth Fusion Systems, Vertical Semiconductor, and Sibelco for up to $389 million in CHIPS Act R&D funding, covering vertical GaN and ultra-high-purity quartz technologies.
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