Chip Industry Weekly: Multi-Point Roundup on SiC, EPYC, TPU
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On November 13, 2026, Semiconductor Engineering published its weekly chip industry review, summarizing multiple developments. In manufacturing, Infineon achieved the industry's first 300mm silicon carbide (SiC) production at its Villach fab, with 300mm wafers yielding 2.3 times the output of 200mm. On the product side, AMD launched its 6th-generation EPYC processors, along with an AI GPU equipped with 288GB of HBM4; Google released two new products, TPU 8i Max and TPU 8tx. In addition, the review mentioned the Nvidia-related controversy. The report did not disclose specific pricing or launch schedules for these products, nor detailed progress on the Nvidia controversy.
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- Semiconductor Engineering Chips and PackagingChip Industry Week In Review
This week saw busy chip industry news: Infineon achieved the industry's first 300mm SiC manufacturing at its Villach fab, yielding 2.3 times the output of 200mm wafers; AMD launched 6th-gen EPYC processors and a 288GB HBM4 AI GPU, while Google released the TPU 8i Max and TPU 8tx.
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