From Silicon To Systems: Redefining Competitive Advantage, Part 3
From Silicon To Systems: Redefining Competitive Advantage, Part 3
Advantest's Dong Ong talks with ISIG co-founder and CEO Salah Nasri about competitive advantage in the semiconductor industry over the next decade. In the AI era, industry value is shifting from transistor process nodes and single chips to advanced packaging, system integration, software and platform ecosystems; performance depends on how efficiently an entire system moves data, manages energy and coordinates compute, and future winners will be vendors that combine technology, platforms and partnerships into a value system.
The next generation of industry leaders may look very different from the last.
For most of the semiconductor industry’s history, value was captured in fairly predictable places. Smaller transistors, better processing nodes, and higher-performance chips. But the industry is going into a new era. Today, some of the most important breakthroughs are happening outside the transistor itself: in advanced packaging, in AI infrastructure, in system integration, in software, data, and platform ecosystems. And perhaps most importantly, value is beginning to shift from individual components towards the ability to integrate increasingly complex technology into scalable systems.
Because in the age of AI, performance is no longer determined by a single chip itself. It is shaped by how efficiently the entire system can move data, manage energy, coordinate compute, and operate across interconnected systems.
Which means the next generation of industry leaders may look very different from the last. The winners may not simply be those with the best technology, but those who can combine technology, platforms, partnerships, and strategic positioning into coherent systems of value creation.
Advantest’s Dong Ong sits down with Salah Nasri, CEO & co-founder of ISIG (International Semiconductor Industry Group), to discuss where the semiconductor industry is going and what competitive advantage might look like in the next decade.
Don Ong
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Don Ong is director and head of innovation for the Advantest Field Service Business Group.
Source: Semiconductor Engineering Chips and Packaging · semiengineering.com