Shift-Left DE-Via
Shift-Left DE-Via
Siemens' Calibre DesignEnhancer Via (DE-Via) addresses via resistance, electromigration, and routing density issues in physical design by automatically inserting redundant vias, while ensuring layout modifications remain DRC-clean. This shift-left approach improves via robustness early in design, reducing late signoff iterations, and identifies areas prone to shorts while avoiding insertion there to preserve productivity and issue visibility.
Calibre-aware, short-resilient via insertion for signoff-ready physical design.
Physical design teams face challenges with via resistance, electromigration and routing density. Calibre DesignEnhancer Via (DE-Via) automates the insertion of additional vias, ensuring DRC-clean layout modifications.
This shift-left methodology improves via robustness early in the design cycle, reducing late signoff iterations. DE-Via identifies short-prone regions, avoiding insertion in those areas to maintain productivity and visibility into unresolved issues.
What you’ll learn:
- How automated via insertion improves interconnect robustness
- The benefits of a shift-left methodology in physical design
- How DE-Via identifies and avoids short-prone regions
- The integration of DE-Via into existing design flows
- Practical benefits of short-resilient handling in via optimization
Who should read this:
- Physical design engineers
- CAD engineers
- Design implementation teams
- Anyone involved in advanced node physical design
To learn more, click here.
Source: Semiconductor Engineering Chips and Packaging · semiengineering.com