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Oct 9Fri
  1. Semiconductor Engineering Chips and Packaging26

    Chip Industry Week In Review

    TSMC and GlobalFoundries signed a $2 billion agreement under which GlobalFoundries will manufacture silicon interposers for TSMC's CoWoS advanced packaging ecosystem at its Malta, New York plant, with volume production ramping in the first half of 2028.

Sep 9Tue
  1. Mistral AI69

    Mistral raises 1.7B€ to accelerate technological progress with AI

    Mistral AI announced a €1.7 billion Series C at a €11.7 billion post-money valuation, led by ASML, with a strategic partnership established between the two companies.

    Why it matters: Coming from the official announcement, it clearly states the funding amount, valuation and ASML-led strategic partnership intent, helping readers understand Mistral AI's future industry direction.