Lam Research Pushes Glass Substrates for AI Chip Advanced Packaging
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On October 29, 2026, Lam Research introduced its glass substrate technology for AI and HPC advanced packaging. The company is driving the adoption of glass substrates in such packaging: its Kallisto™ panel plating system supports high aspect ratio TGV (through-glass via) fill and fine-pitch RDL (redistribution lines), while the Phoenix panel processing system can handle thin glass substrates and boost throughput. Glass substrates are said to offer advantages such as a tunable CTE (coefficient of thermal expansion), surface flatness enabling line widths down to 2 microns, and excellent electrical isolation. However, the report also notes that widespread adoption of glass substrates still requires resolving manufacturing and standardization challenges. The event is currently at the technology introduction stage, with no reports yet of mass production or customer adoption.
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- Lam Research Semiconductor Manufacturing TechnologyGlass Substrates Open the Window to Advancing AI Chip Packaging
Lam Research is driving the adoption of glass substrates in AI and HPC advanced packaging. Its Kallisto™ panel plating system supports high-aspect-ratio TGV filling and fine-pitch RDL lines, while the Phoenix panel processing system handles thin glass substrates and boosts throughput. Glass substrates offer advantages such as tunable CTE, surface flatness down to 2-micron line widths, and excellent electrical isolation, but widespread adoption still requires solving manufacturing and standardization challenges.
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