Ayar Labs and GUC Validate CPO Feasibility Through Thermal Co-Simulation
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Ayar Labs and GUC jointly conducted thermal co-simulation to validate the feasibility of co-packaged optics (CPO) technology in high-power scenarios. The simulation targeted a CoWoS-L package integrating 8 TeraPHY optical engines, 2 XPUs, and 8 HBM4 modules. According to a report dated October 15, 2026, the package's total power exceeds 3kW and it delivers over 100 Tbps of full-duplex optical interfaces. Simulation results showed the CPO solution can operate reliably within the 3kW package, providing thermal-management-level validation for CPO's use in hyperscale AI compute systems. No further developments on this event have been reported so far.
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- Semiconductor Engineering Chips and PackagingThermal Co-Simulation Testing Of Co-Packaged Optics
Ayar Labs and GUC jointly ran thermal co-simulations on a CoWoS-L package integrating 8 TeraPHY optical engines, 2 XPUs, and 8 HBM4 modules; the package draws over 3kW of power and provides a full-duplex optical interface of more than 100 Tbps.
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