The Trade-off Between Semiconductor Model Sharing and IP Hiding in Advanced Packaging
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On October 28, 2026, Semiconductor Engineering reported on an industry dilemma in the context of advanced packaging: in an advanced packaging flow, the process information one company chooses to hide directly affects another company's prediction accuracy, while suppliers want to share models to support downstream design without revealing their own recipes. Experts from PDF Solutions, Brewer Science, Amkor, ASE, and Silvaco pointed out that while encryption and abstraction can protect recipes, they do not tell downstream engineers where a model fails; static numbers on datasheets are insufficient to reflect real material behavior; and the accuracy of the simulation data used to build surrogate models determines how trustworthy the models are. The report is an industry-trend discussion, with no follow-up developments or concrete implementations yet.
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- Semiconductor Engineering Chips and PackagingHow Much Can Semiconductor Models Hide?
With advanced packaging, process information hidden by one company directly affects another company's prediction accuracy, and suppliers want to share models without revealing their recipes. Experts from PDF Solutions, Brewer Science, Amkor, ASE and Silvaco note that encryption and abstraction protect recipes but do not tell downstream engineers where a model fails; static datasheet numbers are insufficient to reflect real material behavior, and the accuracy of simulation data used to build surrogate models determines their trustworthiness.
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