imec and VUB Study: 3D Integration Reduces GPU Embodied Carbon Emissions
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On November 3, 2026, Semiconductor Engineering reported that researchers from imec and Vrije Universiteit Brussel (VUB) published a paper titled 'Embodied Emissions of 2.5D and 3D Scaling in Chipletized GPUs for Low-Carbon AI'. The study focuses on the embodied emissions (EE) of chipletized GPUs under 2.5D and 3D scaling paths. The research team used imec's netzero modeling platform to estimate the embodied carbon emissions of GPUs under both scaling approaches. The paper's key finding is that 3D integration can reduce embodied carbon emissions during GPU scaling, providing a quantitative reference for low-carbon AI chip design. Currently this is the only report on the event, with no further updates available.
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- Semiconductor Engineering Chips and Packaging3D Integration Reduces Embodied-Emissions Impact Of GPU Scaling (imec, VUB)
Researchers from imec and Vrije Universiteit Brussel (VUB) published a paper titled "Embodied Emissions of 2.5D and 3D Scaling in Chipletized GPUs for Low-Carbon AI", using the imec netzero modeling platform to estimate the embodied emissions (EE) of chipletized GPUs under 2.5D and 3D scaling.
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