Automatic Redundant Via Insertion Methods for Advanced Node Interconnects Explained
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On October 15, 2026, Semiconductor Engineering published an article analyzing the role of automated redundant via insertion in strengthening interconnect reliability in advanced process nodes. The report states that at sub-5nm nodes, interconnect delay has replaced gate delay as the primary bottleneck for SoC power, performance, and area (PPA); as feature sizes shrink, via resistance rises exponentially, further increasing the risks of electromigration (EM) and IR drop, which makes automated insertion of redundant vias necessary to improve interconnect reliability. The report focuses on the causes of this technical problem and an analysis of automated redundant via insertion methods, with no mention of other timelines or follow-up progress.
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- Semiconductor Engineering Chips and PackagingStrengthening Advanced-Node Interconnects Through Automated Via Insertion
At sub-5nm nodes, interconnects have replaced gate delay as the main bottleneck for SoC power, performance, and area (PPA); via resistance rises exponentially as dimensions shrink, worsening electromigration (EM) and IR drop risks.
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