SiPh CPO Mass Production Faces Cross-Domain Optical and Integration Process Control Challenges

On November 10, 2026, Semiconductor Engineering published a report stating that AI's demands for bandwidth, latency, and power efficiency are pushing interconnect technology to its limits, making silicon photonics (SiPh) and co-packaged optics (CPO) viable alternatives to pure electrical interconnects. The report says that for SiPh and CPO to achieve mass production, precise process control is required across multiple layers—optical structures, materials, and integration processes—which is the core challenge currently faced. The report focuses on how to solve these process control challenges in a mass production environment, covering requirements for optical structures, materials, and integration processes. This report is the only source of information on the event so far; there have been no follow-up reports on specific solutions or mass production progress.

AI overview of reporting · Updated 3 h前