Process Control and Inspection Solutions for Hybrid Bonding and Advanced Packaging
Understand the story
On October 8, 2026, Semiconductor Engineering reported on inspection and process control challenges in advanced packaging. The report noted that in advanced packaging, defects accumulate layer by layer as process steps add value, so they must be caught early before they turn into costly failures. As feature sizes shrink, inspection requirements are approaching those of front-end processes. Defect types involved include surface particles, sidewall cracks, buried defects, microbump anomalies, and bonding voids, among others. The report proposed that manufacturers need to combine multiple complementary inspection and metrology techniques within a unified workflow—including high-sensitivity 2D inspection, infrared subsurface inspection, and 3D metrology—to balance sensitivity with throughput. In addition, effective defect classification is needed to turn inspection results into actionable process information that supports process control decisions.
AI overview of reporting · Updated 10 days ago
Reporting timeline
Explore different aspects of the story through its reporting.
- Semiconductor Engineering Chips and PackagingFinding Critical Defects Before They Become Costly Failures: Process Control For Hybrid Bonding And Advanced Packaging
In advanced packaging, defects accumulate value step by step through the process flow, and shrinking feature sizes push inspection requirements toward front-end levels, spanning surface particles, sidewall cracks, buried defects, microbump anomalies and bonding voids. Manufacturers need to combine complementary methods—high-sensitivity 2D inspection, infrared subsurface inspection and 3D metrology—in a unified workflow, balancing sensitivity with throughput, and use effective classification to turn inspection results into actionable process information.