TrendForce Analyzes Bumpless Bonding Routes Beyond Hybrid Bonding
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In its advanced packaging industry insights, TrendForce noted that hybrid bonding is currently the only commercialized bumpless bonding technology, achieving a bonding pitch of about 5 µm, but it is costly and requires stringent cleanroom conditions, so the industry is exploring cheaper bumpless bonding solutions. SK hynix's technology roadmap released in August this year positioned bumpless TCB as a transitional solution between fluxless TCB (supporting a bump pitch of about 8 µm) and hybrid bonding.
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- TrendForce Insights Semiconductor Industry InsightsHybrid Bonding Is Costly. Is There a Cheaper Bumpless Option?
In advanced packaging, hybrid bonding is currently the only commercialized bumpless bonding technology, enabling bonding pitches of about 5 µm, but it is costly and demands stringent cleanroom conditions. SK hynix's roadmap released this August positions bumpless TCB as a transitional solution between fluxless TCB (supporting about 8 µm bump pitch) and hybrid bonding.
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