Onto Innovation Proposes Electrical Process Control Solution for Advanced Packaging
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Semiconductor process control is shifting from traditional visual inspection to electrical measurement. In advanced packaging, residual charge and static charge accumulation are difficult to detect with conventional inspection and metrology tools, yet they affect yield, device reliability, and manufacturing consistency. The problem has become more pronounced with the introduction of hygroscopic films, dielectric layers, and plasma processes. On October 8, 2026, Semiconductor Engineering reported that Onto Innovation proposed the FAaST route based on electrical process control to address this issue, offering full-wafer mapping and panel-level high-resolution mapping capabilities that can locate local non-uniformities and hotspots, thereby enabling electrical process control in advanced packaging. The report only covers the announcement and introduction of this solution; no further deployment or customer application information has been disclosed.
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- Semiconductor Engineering Chips and PackagingThe FAaST Track: Enabling Advanced Packaging Through Electrical Process Control
Semiconductor process control is shifting from visual inspection to electrical measurement. In advanced packaging, residual charge and static accumulation are hard to detect with conventional inspection and metrology, yet they affect yield, device reliability and manufacturing consistency; the problem grows worse with hygroscopic films, dielectric layers and plasma processes. Onto Innovation offers full-wafer mapping and panel-level high-resolution mapping to locate local non-uniformities and hotspots.