Lam Research and imec Expand Collaboration on 3D Integration and Aether Dry Photoresist
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On October 15, 2026, Lam Research announced an expanded joint R&D partnership with imec, adding two major directions on top of the existing collaboration: first, advancing manufacturing readiness for 3D integration and advanced packaging; second, exploring the application of Aether® dry photoresist in imec's High-NA EUV research environment. The expanded collaboration focuses on next-generation semiconductor manufacturing technologies, involving 3D integration, advanced packaging, and R&D validation of dry photoresist in High-NA EUV lithography environments. The event is currently at the announcement stage, with no further reports of implementation progress.
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- Lam Research Semiconductor Manufacturing TechnologyLam and imec Expand Collaboration to Advance Manufacturability of Next-Gen 3D Integration Technologies, Explore Aether Dry Resist Use Cases
Lam Research and imec are expanding their joint R&D collaboration with two new directions: advancing manufacturing readiness of 3D integration and advanced packaging, and advancing Aether® dry resist applications in imec's high-NA EUV research environment.
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