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AI Image Enhancement Improves Flip-Chip Interconnect Defect Detection
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On November 3, 2026, Semiconductor Engineering reported that a research team from Materials Center Leoben, PVA TePla, and ASE published an AI-based image enhancement workflow. The workflow is specifically designed to improve the image quality of scanning acoustic microscopy (SAM) to enhance detection of
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11/3
- Semiconductor Engineering Chips and PackagingAI Image Enhancement Improves Detection Of Flip-Chip Interconnect Defects (MCL, PVA TePla, ASE)
A research team from Materials Center Leoben, PVA TePla and ASE has published an AI-based image enhancement workflow designed to improve scanning acoustic microscopy (SAM) image quality, to enhance detection of "white bump" crack defects in flip-chip ultra-low-K layers.
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