TSMC and GlobalFoundries Sign $2 Billion Silicon Interposer Cooperation Agreement
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On October 9, 2026, Semiconductor Engineering reported that TSMC signed a $2 billion agreement with GlobalFoundries (GF). Under the agreement, GF will manufacture silicon interposers for TSMC's CoWoS advanced packaging ecosystem at its Malta, New York facility, with volume ramp planned for the first half of 2028. This event is part of this week's chip industry news; related coverage also mentioned hyper-NA EUV and AI chip regulation topics. So far, apart from the agreement signing and the production timeline, no further developments have been reported.
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- Semiconductor Engineering Chips and PackagingChip Industry Week In Review
TSMC and GlobalFoundries signed a $2 billion agreement under which GlobalFoundries will manufacture silicon interposers for TSMC's CoWoS advanced packaging ecosystem at its Malta, New York plant, with volume production ramping in the first half of 2028.