OCP Summit: Multiple Vendors Propose Solutions to Break Through the AI Memory Wall

The OCP Global Summit was held October 12–15, 2026. After the event, TrendForce published an analysis on November 6, summarizing new solutions proposed by multiple vendors to address the AI memory wall problem. The core direction is to extend the memory hierarchy beyond HBM — that is, to no longer rely solely on HBM as high-bandwidth memory, but instead build a richer memory hierarchy. Quantitative metrics cited by TrendForce include 3.2TB of memory per XPU and a 14x expansion in HBM capacity. This report is the sole coverage of the event, presenting a post-summit compilation and analysis of vendor solutions, without naming specific vendors or detailing their approaches; further follow-up coverage is needed.

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