Growing Overlap Between Foundries and OSATs in Advanced Packaging
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Semiconductor Engineering analysis points out that as advanced packaging develops and foundry capacity remains tight, the traditional division of labor between foundries and OSATs (packaging and test houses) is becoming increasingly blurred. The article states that the areas of clearest business overlap are 2.5D packaging and panel-level assembly, where both foundries and OSATs are making moves. In addition, the article notes that hybrid bonding technology may also gradually be handed over to the OSAT side in the future. This analysis reflects the rising importance of advanced packaging in the industry, which is reshaping the division of labor between wafer manufacturing and packaging/testing.
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- Semiconductor Engineering Chips and PackagingFoundries And OSATs Increasingly Overlap
Semiconductor Engineering analyzes how advanced packaging and tight foundry capacity are blurring the traditional division of labor between foundries and OSATs, with the clearest overlap in 2.5D packaging and panel-level assembly; hybrid bonding may also gradually shift to OSATs in the future.
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