UCIe White Paper Explains Differences Between 2.5D and 3D Multi-Chip Interconnects
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On November 11, 2026, Semiconductor Engineering reported on a white paper about UCIe die-to-die interconnect technology, which analyzes the application differences and engineering considerations of UCIe in 2.5D and 3D multi-chip designs. The white paper notes that in 2.5D packaging, UCIe links pass through package channels and are affected by insertion loss, crosstalk, and increasing data rates, which places demands on PHY and package design. In 3D designs, due to shorter vertical connections and fine-pitch bonding, bandwidth can be scaled through connection density while reducing the need for high-speed serialization, equalization, and channel training. Currently there is only this single report on the event, with no further progress information.
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- Semiconductor Engineering Chips and PackagingUCIe Connectivity for 2.5D and 3D Multi-Die Designs
A white paper analyzes the differences and engineering considerations of UCIe die-to-die interconnect in 2.5D and 3D multi-die designs. In 2.5D packaging, UCIe links run through package channels, where insertion loss, crosstalk and rising data rates affect PHY and package design; 3D designs use shorter vertical connections and fine-pitch bonding to scale bandwidth through connection density, reducing the need for high-speed serialization, equalization and channel training.
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