ARM Ecosystem Launches AMBA C2C New Chip-to-Chip Interconnect Specification
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On October 15, 2026, Semiconductor Engineering reported that a new specification, AMBA C2C, is being developed within the AMBA ecosystem. Building on the existing AMBA CHI C2C, the specification provides a unified, scalable chiplet interconnect foundation covering both AXI and CHI protocols. The report positions it as a unified AMBA foundation specification for chiplet interconnects; the event is still at the specification development stage, and the report gives no further information such as a release date or adopting vendors.
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- Semiconductor Engineering Chips and PackagingAMBA C2C: Moving Forward With A Converged AMBA Foundation For C2C Connectivity
The AMBA ecosystem is developing a new specification, AMBA C2C, which builds on AMBA CHI C2C to provide a unified, scalable chiplet interconnect foundation covering both AXI and CHI protocols.
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