Cadence and University of Notre Dame Release DAIST Thermal Solver
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On October 19, 2026, Semiconductor Engineering reported that researchers from Cadence Design Systems and the University of Notre Dame published a paper introducing DAIST (Domain-Decomposed AI-Accelerated Iterative Solver for Thermal Analysis), a composable thermal solver. The solver targets heterogeneous 2.5D/3D-IC packages, using domain decomposition and AI-accelerated iterative solution methods for thermal analysis of chips and packages. This is the first report on the event, with no further developments available.
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- Semiconductor Engineering Chips and PackagingA Composable Thermal Solver For Heterogeneous 2.5D/3D-IC Packages (Cadence, Notre Dame)
Cadence Design Systems and University of Notre Dame researchers published a paper proposing DAIST (Domain-Decomposed AI-Accelerated Iterative Solver for Thermal Analysis), a composable thermal solver.
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